1.Control System: Employs a PC + Siemens PLC control system, ensuring precise and stable temperature control with a temperature stability rate exceeding 99.99%.

2.Vacuum System: The PCB board enters the vacuum unit directly from the soldering area. Upon initiation of the vacuum process, the vacuum pressure drops to 100mbar-5mbar. Gases from the pores inside the grounding pads and the gaps in the solder paste escape from the molten solder joints.

1.Control System: Employs a PC + Siemens PLC control system, ensuring precise and stable temperature control with a temperature stability rate exceeding 99.99%.

2.Vacuum System: The PCB board enters the vacuum unit directly from the soldering area. Upon initiation of the vacuum process, the vacuum pressure drops to 100mbar-5mbar. Gases from the pores inside the grounding pads and the gaps in the solder paste escape from the molten solder joints.