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    Introduce of Online 2D AOI AI-5146/5130D

    Introduction:

    For SMT pre-reflow, post-reflow inline inspection;

    Granite platform, greatly improve machine precision and stability;

    Programmable RGB+W LED lighting source;

    2025
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    Introduce of Online 2D AOI AI-5146/5130D

    Introduction:

    For SMT pre-reflow, post-reflow inline inspection;

    Granite platform, greatly improve machine precision and stability;

    Programmable RGB+W LED lighting source;

    Telecentric lens with constant magnification and low distortion response to high component.

    Automatic compensation of PCB warpag, which can deal with FPC and PCB deformed by high temperature

    2025
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    Introduce of online 3D AOI AI-TD5146

    1.The world’s first use of programmable structure grating (PSLM) technology to form a full spectrum structure grating. Compared with the traditional fixed glass moire grating, the software modulation and control of the structure grating are realized. It greatly improves the detection ability and application scope of the equipment.

    2.It adopts AI intelligent seamless jigsaw puzzle technology to reach the level that cannot be distinguished by naked eyes. It greatly facilitates the production and debugging of the program, and reduces the possibility of false positives.

    2025
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    Introduce of SMT Offline AOI MR-680

    1.Full color high speed industrial digital camera

    2.Windows 7 Operation System

    3.High cost performance practical model

    4.Cost effective product line

    5.Annular stereo multi-channel color light

    6.Accurate analysis of wave solder joint

    2025
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    Introduce of Online 3D AOI KOHYOUNG Zenith

    1. Zenith system can perform full 3D inspection on components, patterns, holes and even foreign objects on mounted PCBs, and realize true 3D measurement, solving the shortcomings of 2D inspection technology.

    2. Detect various defects, missing parts, offset, rotation, polarity, reverse parts, OCV/OCR, sideways, tombstones, micro-warping, empty soldering and bridging, etc.

    3. KY’s unique ability to compensate for board bending can minimize the impact of PCB board bending on 3D AOI inspection.

    2025
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    Introduce of Online 3D AOI KOHYOUNG Zenith Alpha

    1. Zenith system can perform full 3D inspection on components, patterns, holes and even foreign objects on mounted PCBs, and realize true 3D measurement, solving the shortcomings of 2D inspection technology.

    2. Detect various defects, missing parts, offset, rotation, polarity, reverse parts, OCV/OCR, sideways, tombstones, micro-warping, empty soldering and bridging, etc.

    3. KY’s unique ability to compensate for board bending can minimize the impact of PCB board bending on 3D AOI inspection.

    2025
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    3D SPI can completely solve the problem of shadow and random reflection in the detection process, so that solder paste 3D detection accuracy is higher; equipped with a 12M pixel high-speed camera, detection speed is faster, the image is more delicate and rich; it is an ideal choice for high-speed and high-precision production lines.
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    1. Solve shadow effect interference in solder paste 3D detection. The combination of RG 2D light source perfectly handles high contrast substrates, such as black substrates, ceramic substrates, etc. Using red, blue, and green light, color 2D images can be provided.
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    64 bit Windows 10 Operation System

    User Frendly Graphlcal Interface

    Color 3D SPI

    High Speed &Performance SPI Standard LIbray

    Enhanced SPC System

    2025
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    1.Combinaton of2D &. 3Dinepection elminates common shadow problem with SPI systems.

    2.64 bit Windows 10 Operation System,Fast & stable operating system for high density PCB.

    3.Conventional SPI methods could only calculateheightsabovesilk print levels, butby usingpatented colorenhancing algofthm TROIT could overcomethese problems,In addition, a fully rotational 3D view of thesolder form is displayed.This enables users to view a “fe like’image of the pad oliminating the need to extract the board from theine to view the defect under a microscope.

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