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Mingrui
Mingrui
Introduction
3D SPI can completely solve the problem of shadow and random reflection in the detection process, so that solder paste 3D detection accuracy is higher; equipped with a 12M pixel high-speed camera, detection speed is faster, the image is more delicate and rich; it is an ideal choice for high-speed and high-precision production lines.
Features
The lens of professional lens design makes the image more uniform and delicate, and greatly improves the stability of detection.
2.It can be imported into Gerber file programming, or can be used to edit and debug money from image editing mode.
3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process.
4.The operation system improves the result recognition and processing function according to the user level interface structure.
High precision programmable black and white moire fringe, the highest measuring accuracy 0.67um.
6.Based on accurate 3 dimensional measurement data, operators can optimize the whole project in a short time.
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Model |
MR-S400 |
MR-S510 |
MR-S510D |
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Measurement System |
PCB Size |
55*55 ~400*400mm |
55*55 ~510*460mm |
400*300mm*2（Dual-Lane) 400*590mm（Single-Lane） (Optional ：510*330mm*2） |
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Rail Fixed |
front fixed (back fixed as option) |
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PCB Tickness |
0.5 ~ 6.0mm |
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PCB Weight |
≤5.0kg |
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Conveyor Adjustment |
automatic |
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Conveyor Height |
900±20mm |
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PCB Direction |
Left ~ Right(Right ~ Left) |
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Software System |
Measure Type |
Height,Area,Volume,Offset,Bridge,Shape（missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination） |
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Paste Height |
0 ~ 550um |
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Accuracy |
XY (Resolution):10um |
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Repeatability Height |
≤1um (4 Sigma), volume/acreage:<1%(4 Sigma) |
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Min Pad Pitch |
≥100um |
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Measure Principle |
3D white light PSLM PMP(Programmable Spatial Light Modulation, Phase Measurement Profilometry) |
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Inspection Head Quanlity |
1 |
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Camera Pixel |
12MP（Optional: 5MP/21MP） |
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Optical Resolution |
5μm/10μm/15μm/20μm |
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FOV Size |
20mm*15mm/40mm*30mm/60mm*45mm |
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Minimum Chip |
0201 |
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Detection Speed |
0.34s/FOV |
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Machine Direction |
Language |
English |
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Program Mode |
Off line or on line |
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Program Time |
5 ~ 10min |
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Data Type |
Gerber Data 274D/274X, Scan PCB |
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SPC & Process Monitoring |
Standard SPC |
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Drive Mode |
Servo Drive |
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Inspection Item |
Inspection type |
Height、Area、Dimension、Offset、Shape |
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Types of Defects Detection |
Print leakage,insufficient solder,excess solder,solder-connection, Skew,odd-shaped,foreign material,Excess solder |
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Option |
Power |
AC200-230,50/60Hz,3KVA |
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Air Pressure |
0.4~ 0.6Mpa |
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Machine Dimension |
W1000*D1150*H1530mm |
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Weight |
965kg |
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