GDMR SMT H series high-end reflow oven is a high-performance reflow oven developed for high-end products according to market demand. The main arm of the reflow oven is strengthened to ensure the lateral deformation of the guide rail, and to prevent the board from being stuck or falling. The multi-layer insulation furnace design reduces the surface temperature of the furnace shell by 10 to 20 degrees, effectively reducing the working environment temperature. The double rail structure effectively improves production efficiency, saves energy and production costs. The upper and lower porous rectifier plates inside the furnace are made of 8MM thickened aluminum alloy，The 15% improvement in heat transfer efficiency can easily cope with the lead-free process requirements of more complex and larger welding products. The new cooling structure design allows most of the exhaust gas to be filtered or recycled and returned to the furnace, reducing heat loss and making the flux recovery more thorough.

1.Control System: Employs a PC + Siemens PLC control system, ensuring precise and stable temperature control with a temperature stability rate exceeding 99.99%.

2.Vacuum System: The PCB board enters the vacuum unit directly from the soldering area. Upon initiation of the vacuum process, the vacuum pressure drops to 100mbar-5mbar. Gases from the pores inside the grounding pads and the gaps in the solder paste escape from the molten solder joints.

1.Control System: Employs a PC + Siemens PLC control system, ensuring precise and stable temperature control with a temperature stability rate exceeding 99.99%.

2.Vacuum System: The PCB board enters the vacuum unit directly from the soldering area. Upon initiation of the vacuum process, the vacuum pressure drops to 100mbar-5mbar. Gases from the pores inside the grounding pads and the gaps in the solder paste escape from the molten solder joints.