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    【Origin Pic】

    1.Control System: Employs a PC + Siemens PLC control system, ensuring precise and stable temperature control with a temperature stability rate exceeding 99.99%.

    2.Vacuum System: The PCB board enters the vacuum unit directly from the soldering area. Upon initiation of the vacuum process, the vacuum pressure drops to 100mbar-5mbar. Gases from the pores inside the grounding pads and the gaps in the solder paste escape from the molten solder joints.

    VH0813

    ❙ Introduce of  Vacuum Reflow Oven VH0813/VH1013

    Features:

    1. Control System: Employs a PC + Siemens PLC control system, ensuring precise and stable temperature control with a temperature stability rate exceeding 99.99%.
    2. Vacuum System: The PCB board enters the vacuum unit directly from the soldering area. Upon initiation of the vacuum process, the vacuum pressure drops to 100mbar-5mbar. Gases from the pores inside the grounding pads and the gaps in the solder paste escape from the molten solder joints.
    3. Hot Air System: Utilizes a top-tier heating module and optimized temperature zoning design to achieve optimal temperature uniformity and repeatability. Highly efficient utilization and thermal compensation ensure that the temperature stabilizes within less than 20 minutes, achieving a control accuracy of ±1℃ from ambient temperature.
    4. Monitoring Software: Windows interface with password-protected access control for easy operation. Features include operation logging, process monitoring, automatic generation and saving of process control documents, and dynamic display of substrate transfer.
    5. Cooling System: A brand-new cooling zone allows for quick and easy adjustment, easily meeting the cooling needs of different slopes;
    6. Temperature Protection: GDMR employs third-party over-temperature protection, with multiple layers of protection ensuring safe operation;
    7. Product complies with CE, CCC, UL, and other standards and specifications;
    8. User-friendly Design: Fault detection (such as heater malfunction alarms), regular maintenance reminders, economical functions, and tool-free maintenance reduce equipment failure rates;
    9. Heating Module: The horizontal reflow soldering design ensures that temperatures in each zone do not affect each other, ensuring accurate temperature profiles while guaranteeing high throughput and heat exchange capacity, achieving high adaptability (meeting the welding needs of automotive, communication, electronics, computer, mobile phone, and consumer electronics products);
    10. The hot air motor uses independent frequency conversion control, allowing the operating frequency to be set according to different processes, meeting the requirements of various lead-free soldering processes;
    11. Key Components: Imported key components ensure smooth equipment operation and reduce maintenance costs;
    12. Standard flux recovery system ensures furnace cleanliness.

    Nitrogen and online temperature monitoring system (SPC) are optional.

    ❙ Specification of  Vacuum Reflow Oven VH0813/VH1013

    No.

    Item

    VH0813

    VH1013

    1

    Dimension

    L6400*W1695*H1650

    L7170*W1695*H1650

    2

    Weight

    3000KG

    3500KG

    3

    Number of heating zone

    Top 8 /Bottom 8

    Top10 /Bottom 10

    4

    Length of heating zone

    3110mm

    3892mm

    5

    Number of cooling zone

    Top 3 /Bottom 3

    Top 3 /Bottom 3

    6

    Exhaust volume requiement

    11m³/min*2

    12m³/min*2

    7

    Power

    3phase, N,PE;AC380V50/60HZ

    3phase, N,PE;AC380V50/60HZ

    8

    Total power

    67KW

    83KW

    9

    Startup power

    32KW

    38KW

    10

    Normal power consumption

    10KW

    12KW

    11

    Warming Time

    Approx:20min-25min

    12

    Temperature control range

    Room temperature -300℃

    13

    Temperature control Mode

    PID close loop cont+SSR driving

    14

    Temperature control precision

    ±1℃

    15

    Temperature deviaation on PCB

    ±1℃

     

    Conveyor system

    16

    Rails structure

    Three-stage independent

    17

    Max width of PCB

    150*150MM-400*400MM

    18

    Range of rail width

    50mm-400mm

    19

    Components height

    Up 30mm/down 30mm

    20

    Conveyor direction

    L-R

    21

    Conveyor fixed type

    Front end fixing

    22

    PCB conveyor direction

    Guide rail plus chain

    23

    Conveyor height

    900±20mm

    24

    Conveyor speed

    300mm-2000mm

    25

    Auto-lubrication

    Can set a variety of automatic or manual filling high temperature lubricating oil

     

    Vacuum chamber transport

    26

    Width modulation

    Three-stage synchronous width adjustment

    27

    Vacuum chamber mode of transport

    Independent transport

    28

    Ultimate vacuum

    50PA

    29

    Vacuum extraction method

    Four-stage independent vacuum

     

    Cooling system

     

    30

     

    Cooling method

    Forced air cooling (vacuum reflow soldering)

    Chiller cooling (vacuum nitrogen reflow soldering)

    Options

    31

    Nitrogen System

    Nitrogen confined structures and pipelines, nitrogen flow meters, chillers

    32

    Anti-stuck structure

    No affects by PCB thickness, no manually adjusting to solder products of different thickness, 1mm-2mm-3mm can be soldered

     

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