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    Introduce of online 3D AOI AI-TD5146

    1.The world’s first use of programmable structure grating (PSLM) technology to form a full spectrum structure grating. Compared with the traditional fixed glass moire grating, the software modulation and control of the structure grating are realized. It greatly improves the detection ability and application scope of the equipment.

    2.It adopts AI intelligent seamless jigsaw puzzle technology to reach the level that cannot be distinguished by naked eyes. It greatly facilitates the production and debugging of the program, and reduces the possibility of false positives.

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    Introduce of SMT Offline AOI MR-680

    1.Full color high speed industrial digital camera

    2.Windows 7 Operation System

    3.High cost performance practical model

    4.Cost effective product line

    5.Annular stereo multi-channel color light

    6.Accurate analysis of wave solder joint

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    Introduce of Online 3D AOI KOHYOUNG Zenith

    1. Zenith system can perform full 3D inspection on components, patterns, holes and even foreign objects on mounted PCBs, and realize true 3D measurement, solving the shortcomings of 2D inspection technology.

    2. Detect various defects, missing parts, offset, rotation, polarity, reverse parts, OCV/OCR, sideways, tombstones, micro-warping, empty soldering and bridging, etc.

    3. KY’s unique ability to compensate for board bending can minimize the impact of PCB board bending on 3D AOI inspection.

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    Introduce of Online 3D AOI KOHYOUNG Zenith Alpha

    1. Zenith system can perform full 3D inspection on components, patterns, holes and even foreign objects on mounted PCBs, and realize true 3D measurement, solving the shortcomings of 2D inspection technology.

    2. Detect various defects, missing parts, offset, rotation, polarity, reverse parts, OCV/OCR, sideways, tombstones, micro-warping, empty soldering and bridging, etc.

    3. KY’s unique ability to compensate for board bending can minimize the impact of PCB board bending on 3D AOI inspection.

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    3D SPI can completely solve the problem of shadow and random reflection in the detection process, so that solder paste 3D detection accuracy is higher; equipped with a 12M pixel high-speed camera, detection speed is faster, the image is more delicate and rich; it is an ideal choice for high-speed and high-precision production lines.
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    1. Solve shadow effect interference in solder paste 3D detection. The combination of RG 2D light source perfectly handles high contrast substrates, such as black substrates, ceramic substrates, etc. Using red, blue, and green light, color 2D images can be provided.
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    64 bit Windows 10 Operation System

    User Frendly Graphlcal Interface

    Color 3D SPI

    High Speed &Performance SPI Standard LIbray

    Enhanced SPC System

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    1.Combinaton of2D &. 3Dinepection elminates common shadow problem with SPI systems.

    2.64 bit Windows 10 Operation System,Fast & stable operating system for high density PCB.

    3.Conventional SPI methods could only calculateheightsabovesilk print levels, butby usingpatented colorenhancing algofthm TROIT could overcomethese problems,In addition, a fully rotational 3D view of thesolder form is displayed.This enables users to view a “fe like’image of the pad oliminating the need to extract the board from theine to view the defect under a microscope.

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    GDMR SMT H series high-end reflow oven is a high-performance reflow oven developed for high-end products according to market demand. The main arm of the reflow oven is strengthened to ensure the lateral deformation of the guide rail, and to prevent the board from being stuck or falling. The multi-layer insulation furnace design reduces the surface temperature of the furnace shell by 10 to 20 degrees, effectively reducing the working environment temperature. The double rail structure effectively improves production efficiency, saves energy and production costs. The upper and lower porous rectifier plates inside the furnace are made of 8MM thickened aluminum alloy,The 15% improvement in heat transfer efficiency can easily cope with the lead-free process requirements of more complex and larger welding products. The new cooling structure design allows most of the exhaust gas to be filtered or recycled and returned to the furnace, reducing heat loss and making the flux recovery more thorough.
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