1.Combinaton of2D &. 3Dinepection elminates common shadow problem with SPI systems.

2.64 bit Windows 10 Operation System,Fast & stable operating system for high density PCB.

3.Conventional SPI methods could only calculateheightsabovesilk print levels, butby usingpatented colorenhancing algofthm TROIT could overcomethese problems,In addition, a fully rotational 3D view of thesolder form is displayed.This enables users to view a “fe like’image of the pad oliminating the need to extract the board from theine to view the defect under a microscope.

GDMR SMT H series high-end reflow oven is a high-performance reflow oven developed for high-end products according to market demand. The main arm of the reflow oven is strengthened to ensure the lateral deformation of the guide rail, and to prevent the board from being stuck or falling. The multi-layer insulation furnace design reduces the surface temperature of the furnace shell by 10 to 20 degrees, effectively reducing the working environment temperature. The double rail structure effectively improves production efficiency, saves energy and production costs. The upper and lower porous rectifier plates inside the furnace are made of 8MM thickened aluminum alloy，The 15% improvement in heat transfer efficiency can easily cope with the lead-free process requirements of more complex and larger welding products. The new cooling structure design allows most of the exhaust gas to be filtered or recycled and returned to the furnace, reducing heat loss and making the flux recovery more thorough.