PCBA cutting equipment is widely used in electronic manufacturing, covering multiple fields such as consumer electronics, automotive electronics, medical equipment, industrial control, communication, and aerospace. Its core function is to achieve high-precision and low stress segmentation of circuit board splicing through mechanical or laser technology. The following is an analysis of specific application scenarios and device advantages:
1、 Consumer electronics field: High precision and efficient production
Smartphones and tablets
Application scenarios: motherboards, module boards, and high-density, miniaturized circuit boards that need to be processed.
Equipment advantages:
Laser cutting equipment (such as UV laser cutting machine): With a small heat affected zone, it is suitable for processing highly integrated PCBA to avoid component damage.
Fully automatic milling cutter splitting machine: Double table design synchronizes splitting and loading/unloading, increasing efficiency by more than 30%, meeting the needs of large-scale production.
wearable devices
Application scenario: FPC (flexible circuit board) cutting for smart watches and VR/AR devices.
Equipment advantages:
Mechanical milling: Customize tool paths to achieve complex contour cutting, with no burrs on the edges, and adapt to curved screen fitting.
Low stress control: Cutting stress ≤ 180 μ ST to avoid damage to flexible materials.
2、 Automotive electronics field: high reliability and environmental adaptability
Vehicle electronic control unit (ECU)
Application scenario: Suitable for working environments ranging from -20 ℃ to 85 ℃, ensuring signal integrity.
Equipment advantages:
Non destructive splitting of multi-layer boards: Milling cutter splitting avoids interlayer separation and replaces the potential risks of laser cutting.
High precision edge control: The perpendicularity of the incision is less than 0.005mm, ensuring precise assembly with the shell.
Sensors and connectors
Application scenarios: USB/HDMI interface reinforcement board, gold finger interface molding.
Equipment advantages:
Precision cutting: Edge flatness<0.02mm to avoid signal transmission failures.
Reinforcement of connector area: precise cutting of FR-4 or metal reinforcement sheets to enhance insertion and removal durability.
3、 Medical equipment field: high-precision and clean production
Implantable device circuit board
Application scenario: Cutting of pacemaker motherboards, which must comply with the ISO 13485 quality management system.
Equipment advantages:
Micron level accuracy: The laser cutting accuracy reaches ± 0.01mm, ensuring compatibility with biological tissues.
Cleanroom standard: Integrated exhaust gas treatment system to avoid dust pollution.
Diagnostic and monitoring equipment
Application scenario: ICT online testing of solder pad exposure requires 100% probe contact.
Equipment advantages:
Mechanical removal of solder mask layer: precise exposure of test points, improving test pass rate.
Low stress cutting: avoids component detachment and ensures long-term stability of the equipment.
4、 Industrial control field: complex plate shapes and customized production
Server and workstation motherboards
Application scenario: Divide FR-4 substrates with a thickness of 1.6-3.2mm and support large-sized circuit boards.
Equipment advantages:
Large format workbench: compatible with cutting sizes of 350 × 300mm, suitable for multi piece designs.
Dual spindle system: supports milling cutters with a diameter of 0.8-3.0mm and a maximum speed of 60000RPM, improving machining efficiency.
Customized PCB for industrial controllers
Application scenario: Small batch trial production and prototype development, requiring rapid changeover.
Equipment advantages:
Quick tool change and parameter adjustment: reduce mold costs and shorten delivery cycles by 50%.
Offline programming function: supports DXF graphic import, simplifies the operation process.
5、 Communication and Aerospace Fields: Special Materials and Extreme Environments
5G base station PCB
Application scenario: Cutting PTFE high-frequency plates and ceramic filled substrates, ensuring signal integrity.
Equipment advantages:
Tungsten carbide cutting tools+low-temperature cooling: reduces brittle material fragmentation and replaces burrs in laser cutting.
High precision motion platform: Ensure precise alignment between the cutting path and the PCB V-groove.
Satellite circuit board
Application scenario: Divide PCBs with more than 8 layers and avoid interlayer separation.
Equipment advantages:
Milling cutter splitting technology: replacing the potential risks of laser cutting and ensuring the integrity of the signal layer.
Visual positioning system: Achieve a cutting accuracy of ± 0.02mm through MARK point positioning and correction algorithm.
