PCBA cutting equipment is a key device used in the field of electronic manufacturing to accurately segment large or multi connected PCB boards into independent units. Its core function is to achieve efficient and low stress cutting through mechanical or laser technology to meet the precision manufacturing needs of industries such as consumer electronics, automotive electronics, and medical equipment. The following is a detailed introduction to PCBA cutting equipment:
1、 Equipment type and technical characteriics
Guillotine type slitting machine
Principle: Adopting a dual straight blade design with upper blade movement and lower blade fixation, vertical cutting is achieved through V-groove positioning.
Advantages: Low cutting stress (≤ 180 μ ST), avoiding tin cracking; Support 0.3mm precision V-groove cutting with an accuracy of ± 0.05mm.
Application: Suitable for scenarios with high reliability requirements such as automotive electronics and server motherboards.
Laser Splitting Machine
Principle: Configure a 15W ultraviolet laser and a high-precision scanning mirror to reduce mechanical stress through non-contact cutting.
Advantages: Cutting accuracy reaches micrometer level, suitable for complex shaped circuit boards; Integrated exhaust gas treatment system, compliant with cleanroom standards.
Applications: high-precision medical equipment, consumer electronics, etc.
Stamp hole milling cutter type slitting machine
Principle: Use high-speed rotating spindle to drive milling cutter to cut along the designed route.
Advantages: Eliminating stamping costs and achieving high cutting accuracy; Support high-speed spindle motors to reduce cutting pressure.
Applications: Micro electronic devices, precision instruments, etc.
Fully automatic curve dividing machine
Principle: Control the milling cutter path through programming to achieve curve cutting.
Advantages: Supports dual spindle synchronous operation, doubling production capacity; Integrated visual positioning system ensures precise cutting path.
Applications: Alien circuit boards, high-density component boards, etc.
2、 Core performance indicators
Cutting accuracy: The mainstream equipment has an accuracy of ± 0.05mm, and high-end models can reach ± 0.02mm.
Cutting stress: By using a wedge-shaped cutting tool linear splitting process, the stress is controlled below 180 μ ST to avoid component damage.
Compatibility: Supports cutting from 0.3mm ultra-thin plates to 3.2mm thick plates, compatible with materials such as FR-4, aluminum substrates, ceramic substrates, etc.
Efficiency: The dual station design allows for simultaneous cutting and placement, shortening the production cycle; Some models process over 500 pieces per hour.
3、 Application Fields
Consumer electronics: smartphone motherboards, tablet module boards.
Automotive manufacturing: Cutting of on-board electronic control units (ECUs), suitable for working environments ranging from -20 ℃ to 85 ℃.
Medical devices: implantable device circuit board slitting, meeting the requirements of ISO 13485 quality management system.
Industrial equipment: Server motherboard segmentation, supporting FR-4 substrates with a thickness of 1.6-3.2mm.
4、 Selection suggestions
Accuracy requirement: Laser or high-precision milling cutter splitting machines are preferred in the medical and aviation fields.
Cost sensitive: For small and medium-sized production, a knife type or manual push type plate splitter can be used.
Automation requirements: It is recommended to equip large-scale production lines with fully automatic curve splitting machines that support dual station and visual positioning.
Material compatibility: Aluminum substrates and ceramic substrates require equipment equipped with high-pressure cooling systems.
